Analytical thermal model of a generic multi-layer spacerless three-dimensional package.

摘要

The need for more functions in a single device has lead to die stacking architecture. Although the number of die increases further to accommodate package functionality, the overall package dimensions have not increased, they have stayed the same or decreased (roughly 1.4mm). Recently, Samsung announced a 16 dice stacked device. If this trend continues, in order to keep the same package height, alternate stacking structures need to be investigated. One such opportunity is spacerless die stacking architecture. Using dummy silicon spacers add cost to a package and do not increase the memory or functionality although the spacers serve as enablers for wire bonding of same size dice. Spacerless architecture reduces the package height by eliminating spacers or dummy dice. This allows for an increased number if active die to be stacked directly on one another without changing the overall package height, or in some cases reducing the package height.;Previous work (Haji-Sheikh et al.) has been done to develop steady-State heat conduction model in a two-layer body. This analytical model will be extended to the current multi-layered generic spacerless three dimensional packages (3DP) enabling the computation of temperature for uniform powered dice. The computation will account for the contact resistance created by the die attach and the solder balls. The aim is to formulate an analytical method to calculate the temperature on an increased number of dice without reformulating equations for each configuration.