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Thermal analytical modeling manner and thermal analytical modeling program

机译:热解析建模方式及热解析建模程序

摘要

PROBLEM TO BE SOLVED: To simply and quickly perform thermal analysis of a substrate by creating a proper model without depending on a specialist concerning the thermal analysis of the substrate mounting a heat generation component in regard to a thermal analysis modelling method and a thermal analysis modelling program for creating the model performing the thermal analysis of the substrate mounting the heat generation component.;SOLUTION: The thermal analysis modelling method has a step for designating the heat generation component mounted on the substrate and an error, a step for creating the model considered to correspond to a designated error from component basic information DB created previously concerning the designated component, and a step for determining the model of the component in an error range by discriminating whether it is in the error range together with thermal resistance of the component prepared previously concerning the created model and repeating taking-out of the model considered to correspond to the other error when it is not in the error range.;COPYRIGHT: (C)2005,JPO&NCIPI
机译:要解决的问题:通过创建适当的模型来简单快速地执行基板的热分析,而无需依赖专家对安装有发热组件的基板的热分析进行热分析建模方法和热分析建模解决方案:热分析建模方法具有指定安装在基板上的生热组件的步骤和一个错误,以及创建考虑的模型的步骤对应于来自先前创建的与指定部件有关的部件基本信息DB中的指定错误,以及通过与先前准备的部​​件的热阻一起辨别是否在误差范围内来确定误差范围内的部件模型的步骤关于创建的模型并重复取出模型不在误差范围内时被认为与另一个误差相对应。;版权:(C)2005,JPO&NCIPI

著录项

  • 公开/公告号JP4213500B2

    专利类型

  • 公开/公告日2009-01-21

    原文格式PDF

  • 申请/专利权人 富士通株式会社;

    申请/专利号JP20030107934

  • 发明设计人 松下 秀治;福田 孝志;

    申请日2003-04-11

  • 分类号G06F17/50;

  • 国家 JP

  • 入库时间 2022-08-21 19:37:48

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