首页> 外文学位 >Morphology and Schottky barrier formation at metal/III-V-semiconductor interfaces.
【24h】

Morphology and Schottky barrier formation at metal/III-V-semiconductor interfaces.

机译:金属/ III-V-半导体界面处的形貌和肖特基势垒形成。

获取原文
获取原文并翻译 | 示例

摘要

Measuring and understanding the potential barrier development at metal-semiconductor interfaces is of both practical and fundamental interest. This dissertation examines the development of this potential barrier (the band bending) as a function of metal coverage for a variety of overlayer growth modes. Three issues were of specific interest: (1) characterizing the various growth modes as a function of parameters such as interfacial reactivity and substrate temperature, (2) establishing the influence of the growth mode on photoemission spectroscopy (PES) measurements of band bending, and (3) determining the influence of the overlayer morphology on the band bending itself.;A representative range of overlayer morphologies was observed in our photoemission studies of room-temperature-grown metal/GaP interfaces: reactive overlayers (Al, Au, Cu, Ni, Pd, Al), clustering overlayers (In, Ga, Ag), and ordered, covalently-bonded overlayers (Sn, Sb, Bi). These growth modes were characterized by studying changes of the substrate and overlayer core level spectra as a function of coverage. The bonding of the ordered, covalent systems is of particular interest, providing information pertinent to epitaxy, bond saturation, and surface energy minimization. We have studied the detailed bonding of the 1 ML Sb/GaP (110) interface using the Surface Extended X-ray Absorption Fine Structure and X-ray Standing Waves techniques.;The band bending for certain "model" overlayer morphologies has been characterized. The Bi/Inp (110) system is determined in our PES study to be an ordered, covalently-bonded interface. The band bending established from this PES data suggests that the submonolayer interfacial states are largely attributed to the peripheries of two-dimensional Bi patches. Other unreactive overlayers such as Ag, In, and Ga form clusters on III-V semiconductor surfaces, and these clusters exhibit metallic characteristics from the lowest detectable coverages. The influence of metal clusters on the underlying semiconductor surface potential was quantified using a three-dimensional Poisson solver. We conclude from these calculations that the submonolayer band bending measured by PES from such systems is beyond the influence of the clusters and must be attributed to surface charge states between the clusters.
机译:测量和理解金属-半导体界面上的势垒发展具有实际和根本的意义。本文研究了各种覆盖层生长模式下该势垒(带弯曲)随金属覆盖率的变化。特别需要关注三个问题:(1)根据界面反应性和底物温度等参数表征各种生长模式;(2)确定生长模式对带弯曲的光发射光谱(PES)测量的影响;以及(3)确定覆盖层形态对能带弯曲本身的影响。;在我们对室温生长的金属/ GaP界面的光发射研究中观察到覆盖层形态的代表性范围:反应性覆盖层(Al,Au,Cu,Ni ,Pd,Al),成簇的叠加层(In,Ga,Ag)和有序的,共价键结合的叠加层(Sn,Sb,Bi)。通过研究基底和覆盖层核心能级谱随覆盖率的变化来表征这些生长模式。有序共价体系的键合特别令人感兴趣,它提供了有关外延,键饱和和表面能最小化的信息。我们已经使用表面扩展X射线吸收精细结构和X射线驻波技术研究了1 ML Sb / GaP(110)界面的详细键合。表征了某些“模型”覆盖层形貌的能带弯曲。 Bi / Inp(110)系统在我们的PES研究中被确定为有序的,共价键合的界面。从该PES数据建立的带弯曲表明,亚单层界面态很大程度上归因于二维Bi斑的外围。其他非反应性覆盖层(例如Ag,In和Ga)在III-V半导体表面上形成簇,并且这些簇显示出最低可检测覆盖率的金属特性。金属团簇对下面的半导体表面电势的影响使用三维泊松求解器进行了量化。从这些计算中我们得出结论,由PES从此类系统测量的亚单层带弯曲超出了簇的影响,必须归因于簇之间的表面电荷状态。

著录项

  • 作者

    Miyano, Ken Eugene.;

  • 作者单位

    Stanford University.;

  • 授予单位 Stanford University.;
  • 学科 Electrical engineering.;Condensed matter physics.
  • 学位 Ph.D.
  • 年度 1991
  • 页码 175 p.
  • 总页数 175
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号