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Viscoelastic modeling and simulation of electrostatically actuated RF MEMS switches.

机译:静电驱动RF MEMS开关的粘弹性建模和仿真。

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摘要

The linear viscoelastic behavior of RF MEMS switches is investigated using the Finite Element Method in this study. Relaxation measurements and temperature dependence of thin gold films is the foundation for implementing the viscoelastic material data in the simulations. Due to the operation of the specific MEMS device of interest, charging occurs in the dielectric material, when the switch is electrostatically actuated. These electrostatic forces need to be overcome by mechanical restoring forces for the MEMS switch to open and operate again. Thus, it is important to understand and investigate restoring forces for this class of devices.;A variety of RF MEMS switches, with different geometries, were investigated in this study. Linear viscoelasticity of Gold (Au) has been implemented to observe the relaxation behavior of restoring forces. The effect of geometry on the restoring forces is also investigated. The important effect of temperature dependency and its effect on the restoring forces are demonstrated. Residual stresses, which occur during device fabrication, were included in the simulation models. The role that residual stresses play in controlling the switch restoring forces is examined in detail. Simple hand calculations are included in this study to verify and better understand the FEA results.;Additionally, finite element simulation results are utilized to match analytical modeling of restoring forces. Restoring forces are separated into three components to compare results obtained using different boundary conditions. A good match was obtained between analytical modeling and FEA models, helping to validate the more complex viscoelastic behavior of actual RF MEMS switches. The final models for actual RF MEMS switches currently in operation, included realistic boundary conditions to better mimic the exact operation of these devices.
机译:在此研究中,使用有限元方法研究了RF MEMS开关的线性粘弹性行为。弛豫测量和温度对金薄膜的依赖性是在模拟中实现粘弹性材料数据的基础。由于关注的特定MEMS器件的操作,当开关被静电驱动时,电荷会在介电材料中发生。这些静电力需要通过机械恢复力来克服,以使MEMS开关打开并再次运行。因此,了解和研究此类器件的恢复力非常重要。;本研究对各种具有不同几何形状的RF MEMS开关进行了研究。金(Au)的线性粘弹性已被实施以观察恢复力的松弛行为。还研究了几何形状对恢复力的影响。证明了温度依赖性的重要影响及其对恢复力的影响。仿真模型中包括了在器件制造过程中产生的残余应力。详细检查了残余应力在控制开关恢复力中的作用。本研究中包括简单的手工计算,以验证和更好地理解有限元分析结果;此外,还利用有限元模拟结果来匹配恢复力的解析模型。恢复力分为三个部分,以比较使用不同边界条件获得的结果。分析模型与FEA模型之间取得了很好的匹配,有助于验证实际RF MEMS开关的更复杂的粘弹性行为。当前正在运行的实际RF MEMS开关的最终模型包括现实的边界条件,以更好地模拟这些设备的精确操作。

著录项

  • 作者

    Evren, Alp.;

  • 作者单位

    Lehigh University.;

  • 授予单位 Lehigh University.;
  • 学科 Engineering Electronics and Electrical.;Engineering Mechanical.
  • 学位 M.S.
  • 年度 2010
  • 页码 72 p.
  • 总页数 72
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

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