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Equipment and process modeling and diagnostics in semiconductor manufacturing.

机译:半导体制造中的设备和过程建模以及诊断。

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摘要

The modern semiconductor industry is currently advancing into the world of sub 0.1-micron technology. This thesis aims at developing advanced methodologies for efficient and accurate diagnostics of process and equipment variations.;A furnace system is a typical dynamic system whose physical model can be constructed based on our understanding of the thermal systems. In this thesis we describe how to choose a linear dynamic model to approximate the real system, how to estimate model parameters when system information is only partially available, and how to detect variations of system parameters using a statistical model-classification approach.;Compared to furnace systems, photolithography processes are much more complex. While complicated physical-mathematical models of lithography are available in certain commercial packages, the prohibitively large computation required makes them infeasible for real-time applications. In this thesis, we explore replacing the complex first principle models with simpler empirical models. Due to the high dimensionality and high non-linearity of the problem, a simple mapping usually does not exist between the Critical Dimension (CD) profiles and input recipe parameters, which is desired for diagnosing input parameter variations. Two different approaches are proposed to solve this problem and they may be used complementarily in different situations. The first approach is to construct an explicit inverse model using statistical modeling techniques. The second is to build a library of input-output data pairs and, during diagnostics, search for a candidate-solution set whose statistics are used to calculate the final solution. The two approaches are evaluated and compared on computer simulation results. Finally, time series models are considered to enhance the diagnostics of input parameter variations. The key contribution of this work is that it provides a computationally tractable modeling and diagnostic framework for lithography processes. (Abstract shortened by UMI.).
机译:现代半导体产业目前正进入亚微米以下的技术世界。本论文旨在开发用于对过程和设备变化进行高效,准确诊断的先进方法。熔炉系统是一种典型的动态系统,其物理模型可以基于我们对热系统的理解而构建。在本文中,我们描述了如何选择线性动态模型来逼近真实系统,如何在系统信息仅部分可用的情况下估计模型参数,以及如何使用统计模型分类方法检测系统参数的变化。熔炉系统,光刻工艺要复杂得多。尽管某些商业包装中提供了复杂的光刻物理数学模型,但所需的过大计算量却使其无法用于实时应用。在本文中,我们探索用更简单的经验模型代替复杂的第一原理模型。由于问题的高维和高非线性,通常在关键尺寸(CD)轮廓和输入配方参数之间不存在简单的映射,这是诊断输入参数变化所需要的。提出了两种不同的方法来解决此问题,它们可以在不同情况下互补使用。第一种方法是使用统计建模技术来构造显式逆模型。第二个是建立输入输出数据对的库,并在诊断期间搜索候选解决方案集,其统计信息用于计算最终解决方案。对这两种方法进行了评估,并在计算机仿真结果上进行了比较。最后,考虑使用时间序列模型来增强对输入参数变化的诊断。这项工作的关键贡献在于,它为光刻工艺提供了易于计算的建模和诊断框架。 (摘要由UMI缩短。)。

著录项

  • 作者

    Wang, Jiangxin.;

  • 作者单位

    University of California, Berkeley.;

  • 授予单位 University of California, Berkeley.;
  • 学科 Engineering Mechanical.
  • 学位 Ph.D.
  • 年度 2001
  • 页码 168 p.
  • 总页数 168
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

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