首页> 外文期刊>International Journal of Innovative Computing Information and Control >MATHEMATICAL MODEL OF THERMAL REACTION PROCESS FOR EXTERNAL HEATING EQUIPMENT IN THE MANUFACTURE OF SEMICONDUCTORS (PART Ⅰ)
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MATHEMATICAL MODEL OF THERMAL REACTION PROCESS FOR EXTERNAL HEATING EQUIPMENT IN THE MANUFACTURE OF SEMICONDUCTORS (PART Ⅰ)

机译:半导体制造中外部加热设备热反应过程的数学模型(Ⅰ)。

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摘要

This paper presents a mathematical model for a thermal reaction process of external heating equipment. The new control system design for this process, which treats a heat source flowing model for an externally attached device is proposed. The equation of a distributed parameter system as a coupled system with the heat reaction process is presented. This paper proposes a lumped heating system to replace the distributed heating function with a time delay as a whole element. The model that is equivalent to a system in order to make possible practical devices is considered. This paper discusses the configuration of the linear model using the exact linearization method for the coupled system with external heating equipment.
机译:本文提出了外部加热设备热反应过程的数学模型。提出了针对该过程的新控制系统设计,该设计处理了外部连接设备的热源流动模型。提出了分布式参数系统与热反应过程耦合的方程。本文提出了一种集总加热系统,以一个整体上的延时代替分布式加热功能。考虑了等效于系统的模型,以使可能的实用设备成为可能。本文讨论了使用精确线性化方法与外部加热设备耦合的系统的线性模型的配置。

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