首页> 外文期刊>International Journal of Innovative Computing Information and Control >MATHEMATICAL MODEL OF THERMAL REACTION PROCESS FOR EXTERNAL HEATING EQUIPMENT IN THE MANUFACTURE OF SEMICONDUCTORS (PART Ⅱ)
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MATHEMATICAL MODEL OF THERMAL REACTION PROCESS FOR EXTERNAL HEATING EQUIPMENT IN THE MANUFACTURE OF SEMICONDUCTORS (PART Ⅱ)

机译:半导体制造外部加热设备热反应过程的数学模型(第二部分)

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摘要

This paper proposes a mathematical model that is derived from bilinear partial differential equations (BPDs) in order to configure a control system including the external heat equipment (EHE) proposed in Part1. It is widely recognized that the mathematical model of the heat exchange unit has been reported. The target control system can be configured using the control parameter of the overall heat exchange coefficient (OHEC), which is given using a linear approximation from BPDs to an ordinary differential equation (ODE). The numerical simulation results are also represented for the optimal control system, and the gradient method is used in this simulation. Our findings show that this study is suitable for possible practical systems.
机译:本文提出了一个从双线性偏微分方程(BPD)导出的数学模型,以便配置包括第1部分中提出的外部加热设备(EHE)的控制系统。众所周知,已经报道了热交换单元的数学模型。可以使用整体热交换系数(OHEC)的控制参数来配置目标控制系统,该参数是使用BPD与常微分方程(ODE)的线性近似给出的。还给出了最优控制系统的数值仿真结果,并在此仿真中使用了梯度法。我们的发现表明,这项研究适用于可能的实际系统。

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