Experimental/computational analysis of active cooling of stacked device using multidimensional configured thermoelectric modules.

摘要

Stacked devices are currently used widely because of their smaller footprint and corresponding ability to accommodate heterogeneous devices such as memory and logic and enable a silicon efficiency greater than 100%. This configuration will results in thermal management challenges due to the torturous heat dissipation path. In addition, the non-uniformity in chip power distribution results in an increased spreading resistance as well as temperature gradient at the device level that can degrade performance and reliability. In this study the Thermoelectric Modules were configured in a multidimensional form surrounding a three dimensional cold core. The corresponding Computational Fluid Dynamics model is validated using the experimental data.