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A unified hardware-software framework for evaluating power consumption of embedded system-on-a-chip designs.

机译:一个用于评估嵌入式片上系统设计功耗的统一硬件软件框架。

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摘要

Recent years have seen a tremendous growth in both the complexity and demand for embedded computing systems. The rapid increase in design complexity combined with stringent time-to-market requirements has resulted in a need for computer aided design (CAD) tools that can help to make fundamental decisions as early as possible in the design cycle.; In this thesis we developed a framework to efficiently estimate power consumption of embedded System-on-a-Chip (SOC) designs at the system level. Most work to date has focused on the component level, rather than the system level. In these techniques, power consumption is estimated by associating to each component of the system a power model, which is obtained by pre-characterization either at the gate level or at the transistor level. Unfortunately, in order to perform a gate level or a transistor level characterization, a detailed knowledge of the components' internal structure is needed. At the early stage of the design cycle, such information may not be available or intellectual properties (IP) providers may not want to disclose it.; The major contribution of this thesis is to overcome this deficiency. We propose an estimation technique in which the power figures associated to each component of the system are derived from the execution of high level models rather than gate-level or transistor level pre-characterizations. The chief benefit is that design assessment can be done much earlier in the design cycle. As a consequence, engineers can be assisted in their decision-making process from the very beginning of the system design cycle. The use of a higher level of abstraction also leads to approximately three orders of magnitude speedup of the estimation time. We have compared our system-level approach against gate level simulation and actual measurements on the real hardware. The results are within 10% of the gate level and physical measurement.
机译:近年来,嵌入式计算系统的复杂性和需求都出现了巨大的增长。设计复杂性的迅速提高以及对上市时间的严格要求,导致需要计算机辅助设计(CAD)工具,该工具可帮助在设计周期内尽早做出基本决策。在本文中,我们开发了一个框架,可以在系统级别有效地估计嵌入式片上系统(SOC)设计的功耗。迄今为止,大多数工作都集中在组件级别,而不是系统级别。在这些技术中,功耗是通过将功率模型与系统的每个组件相关联来估算的,该功率模型是通过在栅极级或晶体管级进行预表征获得的。不幸的是,为了执行栅极电平或晶体管电平表征,需要对组件的内部结构有详细的了解。在设计周期的初期,可能无法获得此类信息,或者知识产权(IP)提供者可能不想公开这些信息。本文的主要贡献是克服了这一缺陷。我们提出一种估算技术,其中与系统每个组件相关的功率因数是从高层模型的执行而不是门级或晶体管级的预表征中得出的。主要好处是可以在设计周期的更早阶段进行设计评估。因此,从系统设计周期的一开始就可以协助工程师进行决策。使用较高的抽象水平还可以导致估计时间加快大约三个数量级。我们已经将系统级方法与门级仿真和实际硬件上的实际测量进行了比较。结果在门电平和物理测量值的10%以内。

著录项

  • 作者

    Talarico, Claudio.;

  • 作者单位

    University of Hawai'i.;

  • 授予单位 University of Hawai'i.;
  • 学科 Engineering Electronics and Electrical.
  • 学位 Ph.D.
  • 年度 2004
  • 页码 126 p.
  • 总页数 126
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类 无线电电子学、电信技术;
  • 关键词

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