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Electronic States of High-k Oxides in Gate Stack Structures.

机译:栅堆叠结构中高k氧化物的电子状态。

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摘要

In this dissertation, in-situ X-ray and ultraviolet photoemission spectroscopy have been employed to study the interface chemistry and electronic structure of potential high-k gate stack materials. In these gate stack materials, HfO2 and La2O3 are selected as high-k dielectrics, VO2 and ZnO serve as potential channel layer materials. The gate stack structures have been prepared using a reactive electron beam system and a plasma enhanced atomic layer deposition system. Three interrelated issues represent the central themes of the research: 1) the interface band alignment, 2) candidate high-k materials, and 3) band bending, internal electric fields, and charge transfer. 1) The most highlighted issue is the band alignment of specific high-k structures. Band alignment relationships were deduced by analysis of XPS and UPS spectra for three different structures: a) HfO2/VO2/SiO2/Si, b) HfO 2-La2O3/ZnO/SiO2/Si, and c) HfO 2/VO2/ HfO2/SiO2/Si. The valence band offset of HfO2/VO2, ZnO/SiO2 and HfO 2/SiO2 are determined to be 3.4 +/- 0.1, 1.5 +/- 0.1, and 0.7 +/- 0.1 eV. The valence band offset between HfO2-La2O3 and ZnO was almost negligible. Two band alignment models, the electron affinity model and the charge neutrality level model, are discussed. The results show the charge neutrality model is preferred to describe these structures. 2) High-k candidate materials were studied through comparison of pure Hf oxide, pure La oxide, and alloyed Hf-La oxide films. An issue with the application of pure HfO2 is crystallization which may increase the leakage current in gate stack structures. An issue with the application of pure La2O3 is the presence of carbon contamination in the film. Our study shows that the alloyed Hf-La oxide films exhibit an amorphous structure along with reduced carbon contamination. 3) Band bending and internal electric fields in the gate stack structure were observed by XPS and UPS and indicate the charge transfer during the growth and process. The oxygen plasma may induce excess oxygen species with negative charges, which could be removed by He plasma treatment. The final HfO 2 capping layer deposition may reduce the internal potential inside the structures. The band structure was approaching to a flat band condition.
机译:本文采用原位X射线和紫外光电子能谱研究潜在的高k栅堆叠材料的界面化学和电子结构。在这些栅叠层材料中,选择HfO2和La2O3作为高k电介质,VO2和ZnO作为潜在的沟道层材料。已经使用反应性电子束系统和等离子体增强的原子层沉积系统来制备栅极堆叠结构。三个相互关联的问题代表了研究的中心主题:1)界面能带对准,2)候选高k材料和3)能带弯曲,内部电场和电荷转移。 1)最突出的问题是特定高k结构的能带对准。通过对三种不同结构的XPS和UPS光谱分析得出能带对准关系:a)HfO2 / VO2 / SiO2 / Si,b)HfO 2-La2O3 / ZnO / SiO2 / Si,以及c)HfO 2 / VO2 / HfO2 / SiO2 / Si。 HfO2 / VO2,ZnO / SiO2和HfO 2 / SiO2的价带偏移确定为3.4 +/- 0.1、1.5 +/- 0.1和0.7 +/- 0.1 eV。 HfO2-La2O3和ZnO之间的价带偏移几乎可以忽略不计。讨论了两个能带对准模型,即电子亲和力模型和电荷中和能级模型。结果表明,电荷中性模型更适合描述这些结构。 2)通过比较纯Hf氧化物,纯La氧化物和合金化Hf-La氧化物薄膜研究了高k候选材料。使用纯HfO2的问题是结晶,这可能会增加栅堆叠结构中的泄漏电流。使用纯La2O3的问题是薄膜中存在碳污染。我们的研究表明,合金化的Hf-La氧化物薄膜显示出无定形结构并减少了碳污染。 3)通过XPS和UPS观察到栅堆叠结构中的能带弯曲和内部电场,并指示了在生长和过程中的电荷转移。氧等离子体可能会产生带有负电荷的过量氧,可以通过He等离子体处理将其清除。最终的HfO 2覆盖层沉积可能会降低结构内部的内部电势。带结构接近平坦带状态。

著录项

  • 作者

    Zhu, Chiyu.;

  • 作者单位

    Arizona State University.;

  • 授予单位 Arizona State University.;
  • 学科 Physics Condensed Matter.
  • 学位 Ph.D.
  • 年度 2012
  • 页码 160 p.
  • 总页数 160
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

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