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Bilayer metal gate electrodes with tunable work function: Behavior, mechanism, and device characteristics.

机译:具有可调功函数的双层金属栅电极:行为,机理和器件特性。

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摘要

To eliminate poly depletion and to reduce gate leakage current, metal gate/high-k dielectric structures are needed for future CMOS technology. However, it is challenging to engineer the work function of metal gate electrodes and to integrate them with high-k dielectrics. A metal bilayer structure has the ability to adjust the gate work function by varying the bottom layer thickness. In this work, I will discuss this unique work function behavior, investigate the possible mechanisms, and apply this structure to MOSFET devices with high-k dielectrics.; The work function of bilayer metal gates exhibits a gradual transition of the work function as the bottom layer thickness increases from 0 to 6-10mn. With properly selected metal pairs, bilayer metal gates are capable of tuning the work function across the entire Si band edge. The work function tuning behavior is seen for many metal systems and on both SiO2 and high-k dielectrics.; Several possible mechanisms for the work function behavior were investigated, including carrier redistribution, non-uniform thin film deposition, and thermally-activated metal/metal reaction and interdiffusion. Compositional and the electrical analysis of gate stacks were performed to understand the work function behavior before and after annealing. The results point to a diffusion mechanism that saturates after an initial annealing.; Besides the ability to tune the work function, the thin bottom layers can act as buffer/etch-stop layers. In contrast to the traditional dual metal gate process, gate dielectrics can be protected from possible damage or contamination by employing selective etching of one top metal layer from the thin bottom metal layer. This integration scheme was demonstrated to achieve dual work function metal gates on high-k dielectrics by utilizing bilayer metal electrodes and a selective metal wet etch process. Furthermore, gate-last MOSFETs with bilayer metal gate were fabricated to investigate device characteristics including the threshold voltage controllability and the mobility behavior.
机译:为了消除多晶硅耗尽并减少栅极泄漏电流,未来的CMOS技术需要金属栅极/高k介电结构。然而,设计金属栅电极的功函数并将其与高k电介质集成是一项挑战。金属双层结构具有通过改变底层厚度来调节栅极功函数的能力。在这项工作中,我将讨论这种独特的功函数行为,研究可能的机制,并将该结构应用于具有高k电介质的MOSFET器件。随着底层厚度从0增加到6-10mn,双层金属栅极的功函数表现出功函数的逐渐过渡。使用正确选择的金属对,双层金属栅能够在整个Si波段边缘调整功函数。对于许多金属系统以及SiO2和高k电介质,都可以看到功函数的调整行为。研究了功函数行为的几种可能机制,包括载流子的重新分布,不均匀的薄膜沉积以及热活化的金属/金属反应和相互扩散。进行了栅极堆叠的组成和电气分析,以了解退火前后的功函数行为。结果表明扩散机制在初始退火后会饱和。除了能够调整功函数之外,最薄的底层还可以充当缓冲/蚀刻停止层。与传统的双金属栅极工艺相反,通过从薄的底部金属层中选择性蚀刻一层顶部金属层,可以保护栅极电介质免受可能的损坏或污染。通过使用双层金属电极和选择性金属湿法刻蚀工艺,证明了该集成方案可在高k电介质上实现双功函数金属栅极。此外,制造了具有双层金属栅极的后栅极MOSFET,以研究器件特性,包括阈值电压可控性和迁移率行为。

著录项

  • 作者

    Lu, Ching-Huang.;

  • 作者单位

    Stanford University.;

  • 授予单位 Stanford University.;
  • 学科 Engineering Electronics and Electrical.; Engineering Materials Science.
  • 学位 Ph.D.
  • 年度 2007
  • 页码 131 p.
  • 总页数 131
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类 无线电电子学、电信技术;工程材料学;
  • 关键词

  • 入库时间 2022-08-17 11:39:06

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