Densification Mechanism of the Low Temperature Co-Fired Glass-Ceramic Substrate

摘要

In this paper, application of multilayered circuit substrates has been studied, the glass ceramic (50%Al_2O_3-50%glass) with low temperature co-fired and good performance as the raw material was used, by means of calculating the apparent activation energy of densification in the experiment and observing the SEM images of glass ceramic substrate section, the densification mechanism of glass ceramic substrate sintering is analyzed.