Effects of Process Parameters on the Adhesion of Copper Film on Polyethylene Tetrephthalate(Pet) Substrate Prepared by ECRMOCVD Coupled with a Periodic DC Bias

摘要

Characteristics of Cu/C:H films on the PET substrate prepared by ECR-MOCVD coupled with a DC bias under Cu(hfac)_2-Ar-H_2 was investigated with special attention to process parameters. Our results showed that the Cu/C:H film has strongly adhere with the polymer substrate by chemical bonding and exhibited wide range of electrical conductivity that could be controlled by process parameters. The increase in H_2/Ar ratio, microwave power and negative DC bias voltage brought on the higher pulling strength between Cu/C:H films and PET substrate. The effects of surface pretreatments of polymer substrate on pulling strength were insignificant in the range of our experimental range.