机译:负衬底偏置电压对直流反应磁控溅射氧化铝膜结构和性能的影响
State Key Laboratory of Solidification Processing, School of Materials Science and Engineering, Northwestern Polytechnical University, Xi'an 710072, China;
State Key Laboratory of Solidification Processing, School of Materials Science and Engineering, Northwestern Polytechnical University, Xi'an 710072, China;
Department of Electrical Engineering and Computer Science, Northwestern University, Evanston, IL 60208, United States;
State Key Laboratory of Solidification Processing, School of Materials Science and Engineering, Northwestern Polytechnical University, Xi'an 710072, China;
State Key Laboratory of Solidification Processing, School of Materials Science and Engineering, Northwestern Polytechnical University, Xi'an 710072, China;
State Key Laboratory of Solidification Processing, School of Materials Science and Engineering, Northwestern Polytechnical University, Xi'an 710072, China;
aluminum oxide (Al_xO_y) film; DC reactive magnetron sputtering; negative substrate bias voltage (V_b); annealing; heat treatment;
机译:衬底偏压对反应磁控溅射制备的硬质Si-B-C-N薄膜结构和性能的影响
机译:衬底温度对直流反应磁控溅射技术制备锌氧化铝薄膜结构和光学性能的影响
机译:分步沉积对直流磁控溅射制备透明导电掺铝氧化锌薄膜结构和性能的影响
机译:基板偏置电压对双阴极DC不平衡磁控溅射制备的金红石TiO_2薄膜结构的影响
机译:研究ha和铬的添加对沉积在镍基高温合金上的直流磁控溅射β-镍-铝粘结涂层的微观结构和短期氧化性能的影响。
机译:反应磁控溅射制备二元氧化铜薄膜的相变和物理性质
机译:直流偏压对活性射频磁控溅射TiVCrZrTaN薄膜微结构,残余应力和硬度性能的影响