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Effects of negative substrate bias voltage on the structure and properties of aluminum oxide films prepared by DC reactive magnetron sputtering

机译:负衬底偏置电压对直流反应磁控溅射氧化铝膜结构和性能的影响

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摘要

Aluminum oxide thin films (Al_xO_y) were deposited onto Ni-based superalloy substrates by DC reactive magnetron sputtering using Al target in an Ar and O_2 gas environment. Subsequently post-deposition annealing was carried out in air ambient at 500℃ for 1 h with heating rate of 25℃/min and then some annealed samples were heated at 800 ℃ for 1 h to simulate the application environment. Effects of the negative substrate bias voltage (V_b) on the structure and properties of the as-deposited, the annealed and the heated films, such as the deposition rate, elemental composition, surface morphology, microstructure, optical transmittance and microhardness, have been studied. It is found that with the increase of negative V_b (0V, -20V, -30V and -40V), the deposition rate decreases sharply and so do the O/Al ratios of the as-deposited films. While for the annealed films, the O/Al ratios show an increasing trend. All the as-deposited and annealed films are amorphous. However, the heated films are all crystallized and the crystallization gets weaker with the negatively increasing V_b. Grain refinement for the as-deposited films and loose crack surface for the annealed ones are found in the process of negatively increasing V_b to -40 V. And all the annealed films exhibit higher transmittance but lower microhardness than the as-deposited ones.
机译:在Ar和O_2气体环境中,使用Al靶通过DC反应磁控溅射将氧化铝薄膜(Al_xO_y)沉积到Ni基高温合金基底上。随后在空气中以25℃/ min的速率在500℃的环境中进行沉积后退火1 h,然后将一些退火样品在800℃下加热1 h以模拟应用环境。研究了负衬底偏置电压(V_b)对沉积,退火和加热后的薄膜的结构和性能的影响,例如沉积速率,元素组成,表面形态,微观结构,透光率和显微硬度。 。发现随着负V_b(0V,-20V,-30V和-40V)的增加,沉积速率急剧降低,并且所沉积的膜的O / Al比也如此。而对于退火膜,O / Al比显示出增加的趋势。所有沉积和退火的薄膜都是非晶态的。然而,随着V_b的负增加,加热的膜全部结晶并且结晶变得较弱。在将V_b负增大到-40 V的过程中,发现了沉积薄膜的晶粒细化和退火薄膜的松散裂纹表面。与退火薄膜相比,所有退火薄膜都显示出更高的透射率,但显微硬度更低。

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  • 来源
    《Applied Surface Science》 |2012年第2012期|448-453|共6页
  • 作者单位

    State Key Laboratory of Solidification Processing, School of Materials Science and Engineering, Northwestern Polytechnical University, Xi'an 710072, China;

    State Key Laboratory of Solidification Processing, School of Materials Science and Engineering, Northwestern Polytechnical University, Xi'an 710072, China;

    Department of Electrical Engineering and Computer Science, Northwestern University, Evanston, IL 60208, United States;

    State Key Laboratory of Solidification Processing, School of Materials Science and Engineering, Northwestern Polytechnical University, Xi'an 710072, China;

    State Key Laboratory of Solidification Processing, School of Materials Science and Engineering, Northwestern Polytechnical University, Xi'an 710072, China;

    State Key Laboratory of Solidification Processing, School of Materials Science and Engineering, Northwestern Polytechnical University, Xi'an 710072, China;

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  • 正文语种 eng
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  • 关键词

    aluminum oxide (Al_xO_y) film; DC reactive magnetron sputtering; negative substrate bias voltage (V_b); annealing; heat treatment;

    机译:氧化铝(Al_xO_y)膜;直流反应磁控溅射;基板负偏压(V_b);退火;热处理;

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