Texture of Sputtered Thin Copper Films on Amorphous SiO_2 and Si_3N_4 substrates

摘要

Cu films with thickness of 500nm and 5nm have been sputter deposited on amorphous SiO_2 and Si_3N_4 substrates without and after sputter cleaning. The crystallographic texture has been characterized by x-ray diffraction techniques. Sputter cleaning of the substrates, by which the oxygen contaminants are removed from the Si_3N_4 substrates, leads to an increase in the {111} texture strength and sharpness of the Cu films on Si_3N_4 The texture is sharper in the 500nm thick Cu films than in the 5nm thick films. Roughness differences of the substrate surfaces have no obvious effect on the texture state.