首页> 外文会议>Symposium on Nanostructured Interfaces, Apr 2-4, 2002, San Francisco, California >Ge-rich Si_(1-x)Ge_x Nanocrystal Formation by the Oxidation of As-Deposited Thin Amorphous Si_0.7Ge_0.3 Layer
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Ge-rich Si_(1-x)Ge_x Nanocrystal Formation by the Oxidation of As-Deposited Thin Amorphous Si_0.7Ge_0.3 Layer

机译:沉积态非晶Si_0.7Ge_0.3薄层的氧化形成富Ge的Si_(1-x)Ge_x纳米晶体

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Ge-rich Si_(1-x)Ge_x nanocrystals are formed by the selective oxidation of Si during the dry oxidation of an amorphous Si_(0.7)Ge_(0.3) layer. The oxidation kinetics of the alloy film shows the activation energies of linear and parabolic rate constants are about 1.35 and 1.02 eV, respectively, based on the model proposed by Deal and Grove. In addition, as a result of the selective oxidation of Si and Ge pile-up during the oxidation process, Ge-rich Si_(1-x)Ge_x nanocrystals are formed with the size of 5.6+- 1.7 nm and the spatial density of 3.6x10~(11) /cm~2 at 600 ℃. At higher temperature of 700 and 800℃, the size of nanocrystal is increased to about 20 nm. The nanocrystals formation by oxidation is thought to be due to higher oxidation rate at grain boundary than at bulk grain. Therefore, the dependence of size on temperature is explained with the grain size determined by solid phase crystallization of amorphous film, oxidation rate, and grain growth.
机译:在无定形Si_(0.7)Ge_(0.3)层的干法氧化过程中,通过Si的选择性氧化形成了富含Ge的Si_(1-x)Ge_x纳米晶体。根据Deal和Grove提出的模型,合金膜的氧化动力学显示线性和抛物线速率常数的活化能分别约为1.35和1.02 eV。另外,由于在氧化过程中选择性地氧化了Si和Ge堆积,形成了富Ge的Si_(1-x)Ge_x纳米晶体,其尺寸为5.6 +-1.7 nm,空间密度为3.6 600℃时为x10〜(11)/ cm〜2。在700和800℃的较高温度下,纳米晶体的尺寸增加到了20 nm左右。通过氧化形成的纳米晶体被认为是由于在晶界处的氧化速率高于在体晶粒处的氧化速率。因此,用非晶态膜的固相结晶,氧化速度和晶粒长大所确定的晶粒大小来解释尺寸对温度的依赖性。

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