Abstract: speed of microelectronic circuits continues toincrease, the propagation delay between thesemiconductor chips on a conventional multilayerprinted wiring board becomes a bottleneck for achievinghigher system performance. One way to reduce thepackaging delay is to package bare semiconductor dieson a multichip module (MCM). This approach has beensuccessfully implemented on high performance mainframeand supercomputers. In the past several years, therehave been many reports on advanced signal processor andfault tolerant computer modules using thin filmmetal/polyimide MCMs. However, there have been veryfew, if any, implementations on real avionics systems.In this talk, we will examined the reasons why MCMimplementations have not taken off in avionics atpresent. In particular, we will discuss therelationship between cost and performance in MCMimplementation. Performance requirements are defined interms of wiring density, controlled impedance, highfrequency operation, and reliability. Both themanufacturing cost and system cost will be examined.Finally, some future extension of the present MCMtechnology to optical and microwave applications willbe discussed.!0
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