Advanced Multichip Module Packaging of Microelectromechanical Systems

摘要

Multichip modules (MCMs) offer an attractive approach to integrating and packaging microelectromechanical systems (MEMS) because of the ability to support a variety of die types in a common substrate. The primary goal of the research described in this paper is to explore and simulate characteristics of the MEMS packaging using MCMs. A fast noise estimation for MEMS packaging is discussed, which has the advantage of being applicable to a wide range of packaging types without modification. The simulation results formulated in Section 3 show the significant improvements of MCM packaging used for MEMS over a previously used approach.