Thermoset Materials in Microelectronics Packaging

摘要

Building the Science of Thermoset Polymers Thermoset materials have been instrumental in the growth of the microelectronics industry, and Professor Gillham's research has been a key enabler of the value of these materials. Thermosets have long been a staple of electronics and packaging from the first use of phenolic resins in early electrical switches, connectors, and appliances. In the automotive industry, thermosets were the material of choice for the early distributor caps and connector blocks because of their high temperature properties, which made them suitable for under the hood applications. But as important as these applications were, and still are in many cases, they do not compare to the tremendous contributions that thermoset materials have made to the explosive growth of the microelectronics and integrated circuit industries, and the impact these industries have had in transforming our lives and our economic infrastructure. In this presentation, I will highlight molded plastic packaging, one of the more innovative applications of thermosets in microelectronics, and demonstrate how many of these innovations can trace their origins to the pioneering work of John Gillham.