PACKAGE FOR A MICROELECTRONIC DIE MICROELECTRONIC ASSEMBLY CONTAINING SAME MICROELECTRONIC SYSTEM AND METHOD OF REDUCING DIE STRESS IN A MICROELECTRONIC PACKAGE

摘要

A package for the microelectronic die 110 includes a first substrate 120 adjacent the first surface 112 of the die, a second substrate 130 adjacent the first substrate and a second substrate 130 adjacent the second surface 111 of the die. And a heat spreader 140. The heat spreader is in contact with the first substrate and the second substrate.