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Modeling of Lateral Migration Mechanism of Holes in 3D NAND Flash Memory Charge Trap Layer during Retention Operation

机译:保留操作期间3D NAND闪存电荷陷阱层中空穴的横向迁移机制建模

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摘要

In this paper, we analyzed lateral migration mechanism of holes (LM) in 3D NAND Flash memory during retention operation. Retention characteristics were investigated using Technology Computer-Aided Design (TCAD) simulation and modeled using Weibull cumulative distribution function (WCD). Time-constant (τ) at various temperatures were extracted through the modeled equation. Finally, the activation energy (Ea) of LM was extracted by applying to the Arrhenius equation.
机译:在本文中,我们分析了3D NAND闪存在保留操作过程中空穴(LM)的横向迁移机制。使用技术计算机辅助设计(TCAD)仿真研究保留特性,并使用Weibull累积分布函数(WCD)建模。通过建模方程可提取出各种温度下的时间常数(τ)。最后,激活能量(E \ n a \ n)。

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