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Modeling of Lateral Migration Mechanism of Holes in 3D NAND Flash Memory Charge Trap Layer during Retention Operation

机译:保持操作期间3D NAND闪存充电陷阱孔横向迁移机制的建模

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In this paper, we analyzed lateral migration mechanism of holes (LM) in 3D NAND Flash memory during retention operation. Retention characteristics were investigated using Technology Computer-Aided Design (TCAD) simulation and modeled using Weibull cumulative distribution function (WCD). Time-constant (τ) at various temperatures were extracted through the modeled equation. Finally, the activation energy (Ea) of LM was extracted by applying to the Arrhenius equation.
机译:本文在保留操作期间分析了3D NAND闪存中孔(LM)的横向迁移机制。使用技术计算机辅助设计(TCAD)模拟和使用Weibull累积分布函数(WCD)进行建模来研究保留特性。通过建模的方程提取各种温度的时间常数(τ)。最后,激活能量(e a 通过施加到Arrhenius方程来提取LM。

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