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Measurements of Ultra-Shallow Junction (USJ) Sheet Resistance with a Non-Penetrating Four Point Probe

机译:使用非穿透四点探针测量超浅结(USJ)薄层电阻

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摘要

An accurate method to measure the four point probe (4PP) sheet resistance (R_s) of USJ Source-Drain structures is described. The new method utilizes Elastic Material probes (EM-probe) to form non-penetrating contacts to the silicon surface. The probe design is kinematic and the force is controlled to ensure elastic deformation of the probe material. The probe material is selected so that large direct tunneling currents can flow through the native oxide thereby forming a low impedance contact. Sheet resistance measurements on USJ implanted P+/N structures with SIMS junction depths as shallow as 15 nm have been measured. The sheet resistance values obtained with the new EM-probe 4PP method were found to be consistent with expectations. In this paper, the method will be demonstrated on a variety of implanted USJ structures.
机译:描述了一种测量USJ源漏结构的四点探针(4PP)薄层电阻(R_s)的准确方法。新方法利用弹性材料探针(EM-probe)形成与硅表面的非穿透性接触。探针的设计是运动学的,并且控制力以确保探针材料的弹性变形。选择探针材料,以使大的直接隧穿电流可以流过天然氧化物,从而形成低阻抗触点。已经测量了SIMS结深度浅至15 nm的USJ植入P + / N结构的薄层电阻测量值。发现使用新的EM-probe 4PP方法获得的薄层电阻值符合预期。在本文中,将在各种植入的USJ结构上演示该方法。

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