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Formation and Morphology Evolution of Nickel Germanides on Ge (100) under Rapid Thermal Annealing

机译:快速热退火下锗(100)上锗化物的形成和形貌演化

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Phase formation and interfacial microstructure evolution of nickel germanides formed by rapid thermal annealing in a 15-nm Ni/Ge (100) system have been studied. Coexistence of a NiGe layer and Ni-rich germanide particles was detected at 250 ℃. Highly textured NiGe film with a smooth interface with Ge was observed. Annealing at higher temperatures resulted in grain growth and severe grooving of the NiGe film at the substrate side, followed by serious agglomeration above 500 ℃. Fairly low sheet resistance was achieved in 250-500 ℃ where the NiGe film continuity was uninterrupted.
机译:研究了在15 nm Ni / Ge(100)系统中通过快速热退火形成的镍锗化物的相形成和界面微观结构演变。在250℃下检测到NiGe层和富Ni的锗化物颗粒共存。观察到高质感的NiGe膜,与Ge的界面光滑。较高温度下的退火会导致晶粒长大并在基底侧严重腐蚀NiGe膜,然后在500℃以上发生严重的团聚。在250-500℃的NiGe膜连续性不中断的情况下,获得了相当低的薄层电阻。

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