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Performance Evaluation of 15nm Gate Length Double-Gate n-MOSFETs with HighMobility Channels: III-V, Ge and Si

机译:具有高迁移率通道:III-V,Ge和Si的15nm栅极长度双栅极n-MOSFET的性能评估

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We have thoroughly investigated Double Gate (DG) n-MOSFETs with III-V materialsrn(GaAs (111), InP (111), InAs (111) and InSb (111)) and compared to Si (100) and Gern(111). The simulations performed under ballistic transport take into account nonparabolicrnfull band structure, quantum confinement effects, BTBT leakage and SCErneffects. Our results show that with oxide thickness of 0.7 nm, despite of small density ofrnstates (DOS) of these materials, III-V and Ge outperform Si in terms of drive current andrngate delay. However, the high mobility, small bandgap materials like InAs, InSb and Ge,rnsuffer from excessive BTBT current and poor SCE, which limits their scalability. Effectrnof parasitic gate capacitance in DGFET on device performance is given as well.
机译:我们已经对具有III-V材料的双栅极(DG)n-MOSFET进行了全面研究(GaAs(111),InP(111),InAs(111)和InSb(111)),并与Si(100)和Gern(111)进行了比较。在弹道输运下进行的模拟考虑了非抛物线全能带结构,量子约束效应,BTBT泄漏和SCErneffects。我们的结果表明,尽管这些材料的低态态(DOS)密度很小,但氧化物厚度为0.7 nm时,III-V和Ge在驱动电流和栅极延迟方面都优于Si。但是,诸如InAs,InSb和Ge之类的高迁移率,小带隙材料由于过多的BTBT电流和不良的SCE而受阻,这限制了它们的可扩展性。还给出了DGFET中的寄生栅极电容对器件性能的影响。

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