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Comprehensive Performance Benchmarking of III-V and Si nMOSFETs (Gate Length = 13 nm) Considering Supply Voltage and OFF-Current

机译:考虑电源电压和关断电流的III-V和Si nMOSFET(门长度= 13 nm)的综合性能基准

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摘要

Comprehensive performance benchmarking results for III-V and Si nanowire nMOSFETs (gate length of 13 nm) are reported based on the atomistic full-band ballistic quantum transport simulation including the effects of parasitic resistance and capacitance. After optimizing the source/drain doping for III-V nMOSFETs (to balance source exhaustion versus tunneling leakage), the current, capacitance, and switching delay (CV/I) metrics are compared across InAs, GaAs, and Si devices with different crystal orientations at various supply voltage (VDD) and OFF-current (IOFF) targets. III-V nMOSFETs are projected to improve over Si (e.g., up to ~50% reduction in gate-loaded CV/I) for low-power operation (low VDD, low IOFF) while they lose advantage in the high-performance (high VDD, high IOFF target) region. We also provide analytical models for the effects of carrier effective mass and physically explain how the performance comparison of III-V versus Si changes with device scaling.
机译:基于原子全频带弹道量子传输模拟(包括寄生电阻和电容的影响),报告了III-V和Si纳米线nMOSFET(栅极长度为13 nm)的综合性能基准测试结果。优化了III-V型nMOSFET的源极/漏极掺杂(以平衡源极耗尽与隧穿泄漏)后,比较了具有不同晶体取向的InAs,GaAs和Si器件的电流,电容和开关延迟(CV / I)指标处于各种电源电压(VDD)和截止电流(IOFF)目标。对于低功率操作(低VDD,低IOFF),III-V nMOSFET预计将比Si有所改善(例如,栅极负载CV / I降低多达50%),而它们却失去了高性能(高VDD,高IOFF目标)区域。我们还提供了针对载流子有效质量影响的分析模型,并从物理上解释了III-V与Si的性能比较如何随器件缩放而变化。

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