New Developments in CMP Pad Conditioner Technology

摘要

This paper focuses on the challenges and new developments in chemical mechanical planarization (CMP) pad conditioner technology for the next-generation applications, with a special emphasis on the comparative performance characterization of pad conditioners. Empirical data from a number of case studies are presented. Different design 4" disk pad conditioners were evaluated using a benchtop polisher, a benchtop tribometer, and a 300 mm wafer polisher/tribometer to determine pad cut-rate, pad surface roughness, coefficient of friction (COF), and Cu polishing behavior. Results are presented for the effect of pad conditioner design parameters, including abrasive/feature size and distribution, on the pad cut-rate and pad surface roughness. Such information may be helpful in reducing the fab selection and optimization time for pad conditioners in advanced technology node applications. Present study demonstrates the usefulness of pad conditioner laboratory scale characterization.