CMP PAD CONDITIONER MANUFACTURING METHOD AND CMP PAD CONDITIONER USING THE SAME

摘要

The present invention comprises a metal base material, a diamond abrasive grain having a lower end fixed to the surface of the metal base material, and formed on the lower layer surface of the diamond abrasive grain and the surface of the metal base material, and attached to the metal base material surface and the lower layer part of the diamond abrasive grain. A setting plated portion that is plated in a state to fix the diamond abrasive grains, and is formed on the setting plated portion, the metal base material, and the lower layer portion of the diamond abrasive grains, and exposes the upper layer of the diamond abrasive grains to the outside. A method of manufacturing a CMP pad conditioner comprising a supporting layer supporting and a plating layer plated on an upper surface of the supporting layer, and a CMP pad conditioner using the same.