Investigation of Different Nano Scale Energetic Material Systems for Reactive Wafer Bonding

摘要

This paper introduces a method that uses a specific form of local heat generation, which is based on nano scale reactive multilayer systems. Such systems consist of several layers of minimum two different materials with nano scale thicknesses. These layers generate heat based on a self-propagating exothermic reaction during their intermixing. The resulting heat can be used as heat source for bonding processes at chip and wafer-level.