首页> 外文会议>International Semiconductor Device Research Symposium;ISDRS '09 >Improvement on programming and erasing speeds for charge-trapping flash memory device with SiGe buried channel
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Improvement on programming and erasing speeds for charge-trapping flash memory device with SiGe buried channel

机译:具有SiGe埋入沟道的电荷陷阱闪存器件的编程和擦除速度的提高

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摘要

SiGe buried channel with different Ge contents and various thicknesses of Si-cap layer on operation characteristics of charge-trapping (CT) flash devices were studied in this work. The programming and erasing speeds of CT flash devices are significantly improved by employing SiGe buried channel. The retention properties of CT flash devices are satisfactory with suitable Ge content in SiGe buried channel and thickness of Si-cap layer.
机译:本文研究了不同Ge含量和不同厚度的Si-cap层的SiGe掩埋沟道对电荷陷阱(CT)闪存器件工作特性的影响。通过使用SiGe掩埋通道,可以显着提高CT闪存器件的编程和擦除速度。 CT闪光器件的保持性能令人满意,SiGe掩埋通道中的Ge含量合适,且Si盖层的厚度合适。

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