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Electrical characteristics of EEPROM with stacked MIM and n-well capacitor

机译:带堆叠MIM和n阱电容器的EEPROM的电气特性

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EEPROM cell with n-well and MIM capacitor is proposed and fabrication is done by using the 0.18μm standard CMOS process. Single polysilicon EEPROM cell applies the stacked metal-insulator-metal (MIM) or n-well capacitor to increase a memory capacity. Although MIM capacitor cell shows a good device performance, it requires a large device-size. N-well control gate cell has an inherent high junction capacitance and high sheet resistance. In this paper, we propose an EEPROM cell that has both MIM and n-well capacitor in order to achieve a small device size with an excellent programming characteristics. The cell does not require any additional cell area to obtain a high capacitance and has a good control gate coupling ratio with contribution of the junction capacitance between control gate and n-well. Because n-well depletion capacitor is isolated by shallow trench isolation (STI) and MIM capacitor is located just above the n-well capacitor, the cell with two parallel connected capacitors is expected to offer an excellent reliability and noise immunity.
机译:提出了具有n阱和MIM电容器的EEPROM单元,并使用0.18μm标准CMOS工艺完成了制造。单个多晶硅EEPROM单元使用堆叠的金属-绝缘体-金属(MIM)或n阱电容器来增加存储容量。尽管MIM电容器电池显示出良好的设备性能,但它需要较大的设备尺寸。 N阱控制栅单元具有固有的高结电容和高薄层电阻。在本文中,我们提出了一种同时具有MIM和n阱电容器的EEPROM单元,以实现具有良好编程特性的小尺寸器件。该单元不需要任何额外的单元面积即可获得高电容,并具有良好的控制栅耦合比,并具有控制栅与n阱之间的结电容的作用。由于n阱耗尽电容器通过浅沟槽隔离(STI)隔离,并且MIM电容器位于n阱电容器的正上方,因此具有两个并联电容器的电池有望提供出色的可靠性和抗扰性。

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