The Impact of Product Miniaturization on Next Generation SMD Placement Technology

摘要

Modern high-end electronic products like telecom and computer peripheral products, are characterized by a increasing functionality, while at the same time the size and weight of these products are reduced. This can only be realized by miniaturizing these products by means of integration and miniaturization of components and substrates. The variety in end products is increasing, while at the same time time-to-market is decreasing. This means that flexibility requirements for production equipment become more and more a decisive factor. Both miniaturization and flexibility are the two main driving forces in SMD placement technology. Miniaturization both in components and substrates implies that accuracy requirements in SMD placers are increasing and that current processes are reaching their limits of application leading to the introduction of 'new' processes (like interconnection by means of conductive adhesives). Since roadmaps for introduction of new electronic end products needing advanced components and related processes are uncertain, high accuracy SMD placement machine concepts that are based on a platform architecture, highly modular, flexible, scalable and upgradeable are in favor.