Technische Universitat Berlin, Research Center of Microperipheric Technologies,rnTIB 4/2-1, Gustav-Meyer-Allee 25, 13355 Berlin, Germany;
Technische Universitat Berlin, Research Center of Microperipheric Technologies,rnTIB 4/2-1, Gustav-Meyer-Allee 25, 13355 Berlin, Germany;
Fraunhofer Institute for Reliability and Microintegration (Fraunhofer IZM), Gustav-Meyer-Allee 25, 13355 Berlin, Germany;
Technische Universitat Berlin, Research Center of Microperipheric Technologies,rnTIB 4/2-1, Gustav-Meyer-Allee 25, 13355 Berlin, Germany Fraunhofer Institute for Reliability and Microintegration (Fraunhofer IZM), Gustav-Meyer-Allee 25, 13355 Berlin, Germany;
et al;
MEMS/MOEMS packaging; packaging of nanodevices; reliability;
机译:特别节客座社论:MOEMS和MEMS III的可靠性,封装,测试和表征
机译:MEMS和MOEMS的可靠性,封装,测试和特性
机译:MEMS和MOEMS II的可靠性,封装,测试和特性
机译:MEMS&MOEMS的可靠性:晶圆级封装和低温处理问题
机译:MEMS反射镜阵列的可靠性和重复性测试与表征过程。
机译:用于基于sU8-mEms和mOEms结构优化的食人鱼蚀刻过程
机译:特殊课程编辑:MoEMS和MEMS III的可靠性,包装,测试和表征
机译:mEms / mOEms / BiomEms /芯片实验室的可靠性