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An easy approach to identify dislocation types in GaN films through selective chemical etching and atom force microscopy

机译:通过选择性化学蚀刻和原子力显微镜鉴定GaN薄膜中位错类型的简便方法

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Studies have revealed that different dislocation types have different influences on GaN device performance. Identification and discrimination of dislocation types in GaN films will be very helpful to understand the formation mechanism of each type of dislocation, and subsequently to work out corresponding methodologies to reduce each. In this work, two types of etched pits, inverted triangle and trapezoidal, were discovered in GaN films by AFM. Triangle ones were more quickly generated, and would transfer to the other with the increase in etching duration. Theoretical analysis from the viewpoint of strain energy of defects lets us to conclude that the former is from screw dislocation and the latter is formed by mixed dislocation. We consequently obtained the dislocation densities of each type, which agreed well with the XRD results. In summary, this work presents an easy but reliable approach to determine the type and corresponding density of dislocations in GaN.
机译:研究表明,不同的位错类型对GaN器件的性能有不同的影响。识别和区分GaN薄膜中的位错类型将有助于理解每种位错的形成机理,并随后制定相应的方法来减少每种位错。在这项工作中,通过AFM在GaN膜中发现了两种类型的刻蚀坑:倒三角形和梯形。三角形的生成速度更快,并且随着蚀刻持续时间的增加会转移到另一个三角形。从缺陷的应变能角度进行理论分析,可以得出结论,前者是由螺钉位错引起的,后者是由混合位错形成的。因此,我们获得了每种类型的位错密度,与XRD结果吻合得很好。总之,这项工作提出了一种简单而可靠的方法来确定GaN中位错的类型和相应的密度。

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