MEMS Relay with Integrated Hermetic Packaging

摘要

MicroAssembly's radio frequency micro-electromechanical systems (RF MEMS) relay design is based on a proprietary low-temperature wafer-bonding process. This approach offers integrated hermetic packaging and decouples the fabrication of the MEMS and the RF components, enabling optimization. Packaged devices typically exceed 1 billion cycles in 1W cold-switched cycling tests.