The Application of Plasma for the Production of Low-Cost, High-Density PWB's and MCM Substrates. Plasma can be applied to structure various dielectric materials. It simply forms via holes with diameters down to 25 #mu#m or apertures of any shape, like windows, slots etc. and, if desired, routs the whole periphery of PWBs. In addition, it can be used to locally sculpture the surface of the dielectrics. Due to the fact, that plasma driling is a bidirectionl process, it allows an economic formation of micro-vias as well as a double-sided generation of blind vias in various dielectrics, like polyimide, LCPs, FR-X, cyanate ester etc. and is not restricted to one single material. This enables the manufacturing of high-density flex, flex-rigid and rigid PWBs as well as MCM-substrates, up to extreme complexities. This paper presents an overview of the plasma technique applied as well as the basics of the process, including special hole-forming techniques and build-ups of multilayer structures. It, moreover, discusses a selection of realized flexible, flex-rigid and rigid PWBs as well as MCM-substrates for the most various application areas and gives an outlook on future evolutionary and revolutionary developments in this field.
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