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Optical coatings for improved semiconductor diode laser performance

机译:光学涂层可改善半导体二极管激光器的性能

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摘要

In this paper, we describe the development of electron cyclotron resonance plasma enhanced chemical vapour deposition (ECR-PECVD) process for the fabrication of silicon-oxynitride-based optical interference filters and passivation coatings on semiconductor laser facets. The use of in-situ ellipsometry as an effective tool for the monitoring and control of multilayer deposition processes is discussed, and it is shown that careful calibration of the ellipsometer is essential. Various corrections are applied, the most important of which takes into account the variation of the substrate temperature during the deposition of the thin film. Most of the SiN_x films were fabricated from tris(dimethylaminO)silane (TDAS, C_6H_(19)N_3Si) in an Ar plasma. Taking advantage of the inert character of these films, they were applied as encapsulants of sulfur treated Al_xGA_(1-x)As material. Silance (SiH_4) was used for the deposition of filmf of the type SiO_xN_y, and a-Si, providing a wider range of refractive indices than TDAS, thus allowing the implementation of more sophisticated interference filter designs.
机译:在本文中,我们描述了电子回旋共振等离子体增强化学气相沉积(ECR-PECVD)工艺的发展过程,该工艺用于在半导体激光面上制造基于氮氧化硅的光学干涉滤光片和钝化涂层。讨论了使用原位椭偏法作为监测和控制多层沉积过程的有效工具,结果表明,仔细校正椭偏仪是必不可少的。进行了各种校正,其中最重要的是考虑了薄膜沉积过程中基板温度的变化。大多数SiN_x膜是由三(二甲基氨基)硅烷(TDAS,C_6H_(19)N_3Si)在Ar等离子体中制成的。利用这些薄膜的惰性特性,将它们用作经硫处理的Al_xGA_(1-x)As材料的密封剂。沉默(SiH_4)用于沉积SiO_xN_y和a-Si类型的filmf,与TDAS相比,提供了更大的折射率范围,因此可以实现更复杂的干涉滤光片设计。

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