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Optical coatings for improved semiconductor diode laser performance

机译:用于改进的半导体二极管激光器性能的光学涂层

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In this paper, we describe the development of electron cyclotron resonance plasma enhanced chemical vapour deposition (ECR-PECVD) process for the fabrication of silicon-oxynitride-based optical interference filters and passivation coatings on semiconductor laser facets. The use of in-situ ellipsometry as an effective tool for the monitoring and control of multilayer deposition processes is discussed, and it is shown that careful calibration of the ellipsometer is essential. Various corrections are applied, the most important of which takes into account the variation of the substrate temperature during the deposition of the thin film. Most of the SiN_x films were fabricated from tris(dimethylaminO)silane (TDAS, C_6H_(19)N_3Si) in an Ar plasma. Taking advantage of the inert character of these films, they were applied as encapsulants of sulfur treated Al_xGA_(1-x)As material. Silance (SiH_4) was used for the deposition of filmf of the type SiO_xN_y, and a-Si, providing a wider range of refractive indices than TDAS, thus allowing the implementation of more sophisticated interference filter designs.
机译:在本文中,我们描述了电子回旋共振等离子体增强化学气相沉积(ECR-PECVD)工艺的用于基于氮氧化硅的光学干涉滤光器和钝化涂层上的半导体激光器小平面制造的发展。作为用于监测和多层沉积过程的控制的有效工具的使用原位椭偏法的讨论,并且,示出了椭偏仪的校准小心是必不可少的。各种校正被施加,其中最重要的薄膜的沉积过程中考虑到了基片温度的变化。大部分SiN_x膜的是从在Ar等离子体三(二甲氨基)硅烷(TDAS,C_6H_(19)N_3Si)制造。服用这些膜的惰性性质的优点,它们被施加为硫的密封剂处理过的Al_xGA_(1-x)As材料。 Silance(SiH_4)用于类型SiO_xN_y,和a-Si的filmf的沉积,从而提供更宽范围的折射率比TDAS的,因此允许更复杂的干涉滤光器的设计的执行情况。

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