Optimizing the Insulated Metal Substrate Application Through Proper Material Selection and Circuit Fabrication

摘要

The expanding growth in the use of insulated metal substrates in power electronics requires further focus on material and mechanical configuration for each application. By optimizing the material makeup and board format, the performance and reliability expectations can be further achieved. The thermal performance and electrical isolation needs are driven by the power requirements, but considerations of temperature range, mechanical durability and format, along with the physical package surrounding the substrate must also be managed. With a variety of material configurations and circuit format capabilities, the choices become a balancing of options to maximize performance and minimizing cost through Design For Manufacturability in the circuit board fabrication.