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Feature Profile 2D and 3D Simulation with Etching, Deposition, and Implantation Processes

机译:具有蚀刻,沉积和植入过程的特征轮廓2D和3D模拟

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摘要

Interaction of plasmas with solid materials during materials processing involves many phenomena. In most cases, processes of etching, deposition, and implantation go on at the same time, and the final result depends on the balance between those processes. Here, the current approach and progress in feature profile simulations via FPS3D are presented. The FPS3D code provides a convenient environment for simulations of processing for any set of materials and fluxes, as well as for any surface and volume reactions. Moreover, the code can treat "recipes" with arbitrary number of steps, each step having its own set of fluxes. To properly compute effects of implantation, the code estimates penetration depths for all used gaseous species interacting with all used solid materials. We report here on the current status of FPS3D as well as on a supporting molecular dynamics code, MDSS, which is mainly used to prepare data for the input and chemistry files for FPS3D.
机译:在材料加工过程中,等离子体与固体材料的相互作用涉及许多现象。在大多数情况下,蚀刻,沉积和注入过程是同时进行的,最终结果取决于这些过程之间的平衡。在此,介绍了通过FPS3D进行特征轮廓仿真的当前方法和进展。 FPS3D代码为任何一组材料和助焊剂以及任何表面和体积反应的过程仿真提供了一个方便的环境。此外,该代码可以使用任意数量的步骤来处理“配方”,每个步骤都有自己的一组通量。为了正确计算注入效果,该代码估算了与所有固体材料相互作用的所有已使用气态物质的渗透深度。我们在此报告FPS3D的当前状态以及支持的分子动力学代码MDSS,该代码主要用于为FPS3D的输入和化学文件准备数据。

著录项

  • 来源
    《Plasma processing 19》|2012年|61-74|共14页
  • 会议地点 Honolulu HI(US)
  • 作者

    Paul Moroz; Daniel J. Moroz;

  • 作者单位

    Tokyo Electron U.S. Technology Development Center, Tokyo Electron U.S. Holdings, Billerica, MA 01821, USA;

    University of Pennsylvania, Philadelphia, PA 19104, USA;

  • 会议组织
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

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