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Feature Profile 2D and 3D Simulation with Etching, Deposition, and Implantation Processes

机译：具有蚀刻，沉积和植入过程的特征轮廓2D和3D模拟

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Paul Moroza; Daniel J. Morozb;
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1. Multiscale plasma and feature profile simulations of plasma-enhanced chemical vapor deposition and atomic layer deposition processes for titanium thin film fabrication [J] . Denpoh Kazuki, Moroz Paul, Kato Taiki, Japanese journal of applied physics . 2020,第SH期

机译：多尺度等离子体和特征轮廓型等离子体增强化学气相沉积和原子层沉积工艺的钛薄膜制造
2. Atomic-scale Cellular Model And Profile Simulation Of Poly-si Gate Etching In High-density Chlorine-based Plasmas: Effects Of Passivation Layer Formation On Evolution Of Feature Profiles [J] . Yugo Osano, Kouichi Ono Journal of Vacuum Science & Technology. B, Microelectronics and Nanometer Structures . 2008,第4期

机译：高密度氯基等离子体中多晶硅栅刻蚀的原子尺度细胞模型和轮廓模拟：钝化层形成对特征轮廓演变的影响
3. Investigation of etching and deposition processes of Cl-2/O-2/Ar inductively coupled plasmas on silicon by means of plasma-surface simulations and experiments [J] . Tinck S, Boullart W, Bogaerts A Journal of Physics, D. Applied Physics: A Europhysics Journal . 2009,第9期

机译：通过等离子体表面模拟和实验研究在硅上的Cl-2 / O-2 / Ar电感耦合等离子体的蚀刻和沉积过程
4. Feature Profile 2D and 3D Simulation with Etching, Deposition, and Implantation Processes [C] . Paul Moroz, Daniel J. Moroz Symposium on plasma processing 19 . 2013

机译：具有蚀刻，沉积和植入过程的特征简介2D和3D模拟
5. Kinetic Modeling of Halogen-Based Plasma Etching of Complex Oxide Films and its Application to Predictive Feature Profile Simulation. [D] . Marchack, Nathan Philip. 2012

机译：复杂氧化物薄膜的基于卤素的等离子体刻蚀动力学模型及其在预测特征轮廓模拟中的应用。
6. The effect of 2D and 3D cell cultures on treatment response EMT profile and stem cell features in head and neck cancer [O] . Styliani Melissaridou, Emilia Wiechec, Mustafa Magan, 2019

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7. 3D Free-Form Patterning of Silicon by Ion Implantation, Silicon Deposition, and Selective Silicon Etching [O] . Fischer, Andreas C., Belova, Lyubov M., Malm, Gunnar B., 2012

机译：通过离子注入，硅沉积和选择性硅刻蚀对硅进行3D自由形图案化

Feature Profile 2D and 3D Simulation with Etching, Deposition, and Implantation Processes

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