IGBT with higher operation temperature - Power density, lifetime and impact on inverter design

摘要

The development of IGBT power modules has always been characterized by the continuous increasernof the power density for cost reduction and design optimization of the complete frequency converterrnsystem [1]. The requirement of higher power density is directly associated with increased current perrnchip area and therefore an increase of the junction temperature during the operation is expected.rnThe cooling conditions related to applications like hybrid vehicle are further important drivers for thernneed of an increase of the junction temperature [2]. The reason for this is that for cost improvementrnthe cooling of the IGBT module is combined with the combustion engine’s cooling system, whichrnreaches temperatures in the range of 120℃.rnThis paper focuses on the most important questions for the application of power modules withrnincreased junction temperature:rn1. How much more inverter output current can be achieved per chip area?rn2. How much can the cooling effort be reduced?rn3. How does the temperature rise influence further inverter components and what are thernconsequences?rn4. How is the influence to IGBT module`s lifetime expectation?