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Reliability-driven layout decompaction for electromigration failure avoidance in complex mixed-signal IC designs

机译：可靠性驱动的布局分解可避免复杂混合信号IC设计中的电迁移故障

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来源
《Multimedia Communications and Applications》|1991年|p.181-184|共4页
会议地点 San Diego CA USA
作者
Jerke G.; Lienig J.; Scheible J.;
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作者单位

Robert Bosch GmbH, Germany;

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原文格式 PDF
正文语种 eng
中图分类自动化技术、计算机技术;
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专利

1. An Interconnect Reliability-Driven Routing Technique for Electromigration Failure Avoidance [J] . Chen Xiaodao, Liao Chen, Wei Tongquan, Dependable and Secure Computing, IEEE Transactions on . 2012,第5期

机译：一种互连可靠性驱动的路由技术，可避免电迁移故障
2. A binary approach to complex mixed-signal SoC design verification [J] . Graham Bell Electronic Engineering Times . 2005,第1360期

机译：复杂混合信号SoC设计验证的二进制方法
3. Large-Scale Broad-Band Parasitic Extraction for Fast Layout Verification of 3-D RF and Mixed-Signal On-Chip Structures [J] . Feng Ling, Vladimir I. Okhmatovski, Warren Harris, IEEE Transactions on Microwave Theory and Techniques . 2005,第1期

机译：大规模宽带寄生提取，用于3-D RF和混合信号片上结构的快速布局验证
4. Reliability-driven layout decompaction for electromigration failure avoidance in complex mixed-signal IC designs [C] . Goran Jerke, Jens Lienig, Jurgen Scheible, Annual conference on Design automation;Conference on Design automation . 2004

机译：可靠性驱动的布局分解可避免复杂混合信号IC设计中的电迁移故障
5. Modeling and characterization of electromigration failures in IC metallization systems and copper metallization for ULSI application. [D] . Tao, Jiang. 1995

机译：用于ULSI应用的IC金属化系统和铜金属化中电迁移故障的建模和表征。
6. Electromigration failure in a copper dual-damascene structure with a through silicon via [O] . R.L. de Orio, H. Ceric, S. Selberherr -1

机译：具有贯通硅过孔的铜双大马士革结构中的电迁移失败
7. 11.5 Reliability-Driven Layout Decompaction for Electromigration Failure Avoidance in Complex Mixed-Signal IC Designs ∗ [O] . Göran Jerke, Robert Bosch Gmbh, Jens Lienig, 2013

机译：11.5可靠性驱动的布局分解，可避免复杂的混合信号IC设计中的电迁移故障∗
8. Mathematics of Failures in Complex Systems: Characterization and Mitigation of Service Failures in Complex Dynamic Systems [R] . Ray, A. 2007

机译：复杂系统故障数学：复杂动态系统中服务故障的表征与缓解

Reliability-driven layout decompaction for electromigration failure avoidance in complex mixed-signal IC designs

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