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An elevated temperature STM study of the Si(001) c(4x4)surface reconstruction

机译:Si(001)c(4x4)表面重建的高温STM研究

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We have investigated structural of the Si(001) c(4x4) surface reconstruction in the temperature range between 600 deg C and 700 deg C in real time by elevated temperature STM.Shape changes of steps and trenches as well as smudges visible in STM images indicate that silicon is much more mobile on the (2x1) reconstructed than on the c(4x4) reconstructed areas at 600 deg C.Increasing the temperature to 700 deg C leads to the disappearance of the c(4x4) reconstruction.This happens by erosion from the circumference rather than by fragmentation of the c(4x4) reconstructed area.
机译:我们通过高温STM实时研究了温度在600摄氏度至700摄氏度之间的Si(001)c(4x4)表面重建的结构。台阶和沟槽的形状变化以及在STM图像中可见的污迹表明在600摄氏度时(2x1)重建区域的硅比c(4x4)重建区域中的硅更易移动。将温度升高到700摄氏度会导致c(4x4)重建区域的消失,这是由于腐蚀引起的从周围而不是通过c(4x4)重建区域的碎片。

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