首页> 外文会议>Microelectronics (MIEL), 2012 28th International Conference on >Dependence of the electrical and morphological properties on the Ti and Al content in Mo-based ohmic contacts for III–V nitrides
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Dependence of the electrical and morphological properties on the Ti and Al content in Mo-based ohmic contacts for III–V nitrides

机译:电学和形态学特性对III–V族氮化物的Mo基欧姆接触中Ti和Al含量的依赖性

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摘要

Four types of Mo-based ohmic contacts with a varied Al and Ti content are developed and investigated regarding the ohmic properties, surface morphology and edge acuity. It is found out that the Ti/Mo/Ti/Au metallization combines the lowest contact resistivity of 8.8×10−6 Ω.cm2 and low surface roughness of 3.8 nm. The presence of Al in the contact composition does not improve the electrical properties and the surface morphology. Its effect on these properties depends strongly on the Ti/Al ratio in the contact composition.
机译:针对欧姆特性,表面形态和边缘敏锐度,研究并研究了四种具有不同Al和Ti含量的Mo基欧姆接触。发现Ti / Mo / Ti / Au金属化结合了最低的接触电阻率(8.8×10 −6 Ω.cm 2 )和低表面粗糙度(3.8 nm) 。接触组合物中Al的存在不能改善电性能和表面形态。它对这些性能的影响在很大程度上取决于触点组成中的Ti / Al比。

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