首页> 外国专利> Ohmic contact structure for group III nitride semiconductor device having improved surface morphology and well-defined edge features

Ohmic contact structure for group III nitride semiconductor device having improved surface morphology and well-defined edge features

机译:具有改善的表面形态和轮廓分明的边缘的III族氮化物半导体器件的欧姆接触结构

摘要

Embodiments of an ohmic contact structure for a Group III nitride semiconductor device and methods of fabrication thereof are disclosed. In general, the ohmic contact structure has a root-mean-squared (RMS) surface roughness of less than 10 nanometers, and more preferably less than or equal to 7.5 nanometers, and more preferably less than or equal to 5 nanometers, and more preferably less than or equal to 2 nanometers, and even more preferably less than or equal to 1.5 nanometers.
机译:公开了用于III族氮化物半导体器件的欧姆接触结构的实施例及其制造方法。通常,欧姆接触结构的均方根(RMS)表面粗糙度小于10纳米,更优选小于或等于7.5纳米,更优选小于或等于5纳米,并且更优选小于或等于2纳米,并且甚至更优选小于或等于1.5纳米。

著录项

  • 公开/公告号US9548206B2

    专利类型

  • 公开/公告日2017-01-17

    原文格式PDF

  • 申请/专利权人 HELMUT HAGLEITNER;JASON GURGANUS;

    申请/专利号US201113182679

  • 发明设计人 JASON GURGANUS;HELMUT HAGLEITNER;

    申请日2011-07-14

  • 分类号H01L29/45;H01L21/285;H01L29/66;H01L29/778;H01L29/20;

  • 国家 US

  • 入库时间 2022-08-21 13:43:33

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