Modeling of Electrical Properties of Power/Ground Planes in Electronics Packaging

摘要

In electronics packaging, surge currents caused by simultaneously switched drivers will result in voltage fluctuations on power/ground conducting planes. With increasing number of I/Os and speed of switching, the simultaneous switching noise (SSN) can lead to system malfunction. Accurate modeling and efficient simulation of the power/ground plane structures are crucial to predict and reduce the SSN. This paper presents the derivation of analytical models of electrical properties of power/ground planes in electronics packaging, as well as numerical techniques for transient waveform simulation. Analytical models of power/ground planes are based on the radial transmission line theory. SPICE-type equivalent circuits are extracted from analytical models, and transient waveforms can then be simulated by SPICE. An alternative approach, which uses electromagnetic field solvers to directly simulate transient responses of power/ground plane structures, is also presented. Several representative examples, including single and multi-layer packaging structures, are given as illustration.