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Fabrication of Silicon Microneedles Based on Anisotropic Wet Etching Technique

机译:基于各向异性湿法刻蚀的硅微针的制备

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This paper presents a method to fabricate silicon microneedles with aspect ratio by employing anisotropic etching using KOH solution,and also presents the design of technical process of silicon microneedles. Through a series of experiments, we investgate various aspects that have effects on the formation of silicon microneedles during etching. Moreover, the temperature and concentration of etching solution and the concentration of IPA are studied to determine the effects on results of etching and wall-shape of silicon microneedles. When using 50% KOH (KOH 150g, water 150ml) solution in the condition of 87oC water bathing and etching 150min, the silicon microneedles are composed of {411} crystal-lattice plane (inclination 76.37°, height of 100μm).
机译:本文提出了一种采用KOH溶液进行各向异性刻蚀的方法来制备长径比大的硅微针,并提出了硅微针的工艺流程设计。通过一系列实验,我们研究了在蚀刻过程中对硅微针形成有影响的各个方面。此外,研究了蚀刻溶液的温度和浓度以及IPA的浓度,以确定对蚀刻结果和硅微针壁形状的影响。在87oC水浴和蚀刻150min的条件下使用50%KOH(KOH 150g,水150ml)溶液时,硅微针由{411}晶格平面(倾角76.37°,高度100μm)组成。

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