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Study on ultrasonic fusion bonding for polymer microfluidic chips

机译:聚合物微流控芯片的超声熔合研究

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Ultrasonic fusion bonding is a potential method for mass-production of polymer microfluidic chips owning to its advantages like short cycle time,high bonding strength, foreign substances free and so on. However, the micro structures in the chips are easily damaged or even destroyed due to poor controllability and uniformity of the melted energy directors. In this paper, a novel micro joint including energy directors and flow blocks is presented. During ultrasonic bonding, the flow profile of the melted energy directors can be controlled by the dimensions of the flow blocks. Consequently, micro structures on the chips are scarcely affected by the melted polymer. Auxiliary energy-equilibrating structures are also designed to prevent uneven melt of energy directors. Polymethyl methacrylate (PMMA) microfluidic chips with the new joints were fabricated and ultrasonic bonding experiments were conducted. Micro channels with characteristic dimension of tens of microns were successfully sealed without any deformation. And the bonding time was only 0.3 s, which is much shorter than other bonding methods. Results indicate this is a fast, high-strength and deformation free bonding method for polymer microfluidic chips.
机译:超声熔融键合具有循环时间短,键合强度高,无异物等优点,是一种潜在的大规模生产聚合物微流控芯片的方法。然而,由于差的可控性和熔化的能量导向器的均匀性,芯片中的微结构容易损坏甚至破坏。在本文中,提出了一种新型的包括能量导向器和流动块的微接头。在超声粘结过程中,可以通过流动块的尺寸来控制熔化的能量导向器的流动曲线。因此,芯片上的微结构几乎不受熔融聚合物的影响。辅助能量平衡结构还可以防止能量定向器融化不均匀。制备了具有新接头的聚甲基丙烯酸甲酯(PMMA)微流控芯片,并进行了超声键合实验。特征尺寸为数十微米的微通道已成功密封,没有任何变形。而且键合时间仅为0.3 s,比其他键合方法要短得多。结果表明,这是一种用于聚合物微流控芯片的快速,高强度且无变形的粘合方法。

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