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Energy director structure and self-balancing jig for the ultrasonic bonding of microfluidic chips

机译:用于微流控芯片超声粘接的能量导向器结构和自平衡夹具

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摘要

Ultrasonic bonding was widely used to seal polymer microfludic chips due to its high strength, low cost and good biocompatibility. However, in the process of ultrasonic bonding, the easy clogging of microchannels and the difficulty of controlling microchannel heights limit the use of ultrasonic bonding in mass fabrication. In this study, energy director's structure including director protrusion, bonding limited platform and bonding pool is designed and used. A self-balancing jig is designed to automatically adjust with the horn and produce an even bonding energy distribution. Ultrasonic bonding parameters including bonding pressure and bonding time are optimised. The tensile destruction test, leakage test and serum driving test are employed to measure the performance of the ultrasonic bonding chips. Results have shown that the energy director's structure and the self-balancing jig can obviously reduce the clogging of microchannels and improve the uniformity of microchannel heights. By using the optimised bonding parameters, the bonding strength has reached >2.5 Mpa, and channel leakage has not been observed under 0.7 MPa air pressure. The energy director's structure and the self-balancing jig presented here can provide an effective alternative for the mass ultrasonic bonding of microfluidic devices.
机译:超声波键合由于其高强度,低成本和良好的生物相容性而被广泛用于密封聚合物微流控芯片。然而,在超声键合的过程中,微通道的容易堵塞和难以控制的微通道高度限制了超声键合在批量制造中的使用。在这项研究中,设计并使用了能量指向矢的结构,包括指向矢伸出,键合受限平台和键合池。自平衡夹具设计用于自动调整喇叭,并产生均匀的粘结能量分布。优化了超声粘结参数,包括粘结压力和粘结时间。拉伸破坏测试,泄漏测试和血清驱动测试被用来测量超声粘结芯片的性能。结果表明,能量导向器的结构和自平衡夹具可以明显减少微通道的堵塞,提高微通道高度的均匀性。通过使用优化的键合参数,键合强度已达到> 2.5 Mpa,并且在0.7 MPa气压下未观察到通道泄漏。此处介绍的能量指向器的结构和自平衡夹具可以为微流控设备的大规模超声键合提供有效的替代方法。

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